Reinforced Structure Solder Pasteis uniformly blended from proprietary Solder Flux Paste, Alloy powder and nano metal powder. Dispersion strengthening by micro/nano second-phase particles improves the thermodynamic and mechanical properties of solder joints. Reinforced Structure Solder Pastemeets EU RoHS 2.0 and halogen-free requirements and supports no-clean processes.

Solder paste is formulated by mixing fine spherical solder alloy powder with specialized flux at a specific ratio, acting as an effective bonding medium between electronic components. From tiny chips to complex circuit boards, solder paste delivers excellent printability and reliable soldering performance, and establishes stable and precise electrical connections at the micron scale for unobstructed current conduction.Whether for high-throughput SMT manufacturing or stringent lead-free processes with environmental requirements, our solder paste delivers superior quality suitable for diverse applications and lay a solid foundation for reliable electronic products.

Jetting solder paste is a no-clean solder paste with stable continuous jetting performance. It is designed for the connection of electronic components, connectors, integrated circuits, and other products. It delivers stable performance during continuous jetting, without tailing or splattering.