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QW-UF1129 is a one-component solvent-free epoxy underfill - a protective shield for reliable chip interconnect. It features fast flow and cure, good compatibility with solder-paste flux residues, and suits diverse underfill scenarios.
| Specification | QW-UF1129 |
| Name | Underfill Adhesive |
| Appearance | Gray liquid |
| Viscosity | 13 ~ 15 Pa·s (25 °C, AR Rheometer with 25 mm aluminum plate, shear rate 0.1 rad/s) |
| Cure Condition | 120min@165°C/180min@150°C |