Indium sheet is a high-performance thermal interface material engineered for high-power chips and high heat-flux devices.The thermal conductivity reaches up to 81W/(m·K), far surpassing traditional thermal greases. Featuring excellent wettability, ductility and stability, it effectively fills interfacial gaps and substantially reduces thermal contact resistance. It is widely applied in CPUs, GPUs, liquid cooling systems, IGBT modules, power batteries, low-temperature heat transfer and other fields.
| Material | Polymer | Graphene | Soft metal |
| Thermal resistance TR | ~ 20°Cmm²/W | ~ 10°Cmm²/W | ~ 5°Cmm²/W |
| Heat dissipation efficiency | Stable | ModerateStable | Reliable with low risk |
| Thermal Resistance (TR) refers to the temperature rise per watt of CPU power consumption. |
| Material | Spec | Thermal Conductivity | Max operating temperature | Min pressure | 100PSI thermal resistance coefficient |
| In90Ag10 | QW-TIM001 | 67W/m-K | 130°C | 40psi | 0.0513@0.15mm |