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Products
Solder Ball features high sphericity and tight dimensional tolerance. The product line covers multiple alloys and diameters to meet mainstream advanced semiconductor packaging needs. Diameter range: 30-2000 μm, with custom specifications available.
| Alloy | Density g/cm3 | Solid-phase Point °C | Liquid-phase Point °C | Conductivity W/m-K | Tensile Strength MPa | Rigidity HB | CTE 10-6/°C | Poisson's Ratio | Specification |
|---|---|---|---|---|---|---|---|---|---|
| Sn63Pb37 | 8.4 | 183 | 183 | 50 | 31 | 17 | 25 | 0.39 | QW-SP63/37-Qxxx |
| Sn40Pb60 | 9.28 | 183 | 238 | 44 | 37 | 12 | 26 | 0.41 | QW-SP40/60-Qxxx |
| Sn10Pb90 | 10.75 | 275 | 302 | 25 | 30 | 10 | 28 | 0.43 | QW-SP10/90-Qxxx |
| Sn62Pb36Ag2 | 8.41 | 179 | 179 | 50 | 48 | 16 | 24 | 0.39 | QW-SPA362-Qxxx |
| In60Pb40 | 8.52 | 173 | 181 | 29 | 28 | - | 27 | - | QW-IP60/40-Qxxx |
| In80Pb15Ag5 | 7.85 | 149 | 154 | 43 | 28 | 5 | 28 | - | QW-IPA155-Qxxx |
