WeChat Official Account
Tel: 86 023-72183502
Products
Solder Ball features high sphericity and tight dimensional tolerance. The product line covers multiple alloys and diameters to meet mainstream advanced semiconductor packaging needs. Diameter range: 30-2000 μm, with custom specifications available.
| Alloy | Density g/cm3 | Solid-phase Point | Liquid-phase Point | Conductivity W/m-K | Tensile Strength MPa | Rigidity | CTE 10-6/°C | Poisson's Ratio | Specification |
|---|---|---|---|---|---|---|---|---|---|
| Sn96.5Ag3.0Cu0.5 | 7.38 | 217 | 220 | 58 | 49 | 15 | 22 | 0.36 | QW-SAC305-Qxxx |
| Sn96.5Ag3.5 | 7.37 | 221 | 221 | 55 | 57 | 15 | 22 | 0.36 | QW-SA35-Qxxx |
| Sn95Sb5 | 7.25 | 235 | 240 | 28 | 41 | 13 | 21 | 0.35 | QW-SSB05-Qxxx |
| Sn90Sb10 | 7.22 | 240 | 250 | 42 | 44 | - | 27 | - | QW-SSB10-Qxxx |
| In52Sn48 | 7.3 | 118 | 118 | 34 | 12 | 5 | 20 | - | QW-IS48-Qxxx |
| Sn42Bi58 | 8.56 | 138 | 138 | 19 | 55 | 23 | 15 | - | QW-SB42-Qxxx |