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Copper Core Solder Ball is an excellent solution for POP stacked packaging because it provides encapsulation space stability. It also has a certain application in the narrow-pitch packaging field.
| Name | Specification | Thickness(μm) | Diameter(μm) |
|---|---|---|---|
| Au-Plated Copper Core Solder Ball | QW-Au-CCSB | 0.1 | ≥150 |
| Sn-Plated Copper Core Solder Ball | QW-SN-CCSB | 5-50 | 200≤ΦD≤760 |
| Plating of Au, Sn-Pb alloy, pure Sn and SAC305 is available. Customization on the thickness and other composition of plating is also provided. | |||