With the development of flip chip technology, α- particle induced soft errors have gradually become more frequent. Under the current packaging technologies and conditions, the use of low α solder material is a cost-effective measure to reduce the occurrence of soft errors. The LA Sn-based solder products developed by our company are manufactured using low α raw materials, which can effectively reduce the occurrence of soft errors.

Alpha particle emitting level

Low Alpha (LA) (<0.01cph/cm²)

Ultra Low Alpha (ULA) (<0.002 cph/cm²)

Super Ultra Low Alpha (SULA) (<0.001 cph/cm²)

Our company is equipped with the XIA UltraLo-1800 ultra low background alpha counter, which is capable of rapidly detecting alpha particle radiation levels.